EMMC
Embedded MultiMediaCard (eMMC) is a storage solution for embedded systems, which is widely used in electronic devices such as smartphones, tablets, car navigation systems, and digital cameras. eMMC simplifies system design and improves performance by integrating flash storage and controllers in a small package, often soldered directly to the device’s motherboard.
Key features and benefits of eMMC:
Integrated design: eMMC packages NAND flash memory and controller together to form a compact storage solution. This integrated design reduces the need for external components, simplifies board design, and reduces power consumption.
High storage capacity and speed: eMMC supports storage capacity of up to 512GB, and its read and write speeds continue to increase as technology advances. For example, eMMC version 5.1 has a theoretical bandwidth of up to 600MB/s.
Low power consumption: Since the eMMC’s flash memory and controller are integrated, the device CPU no longer needs to process data storage tasks, freeing up CPU resources and reducing overall power consumption.
Reliability: The eMMC has a high degree of reliability and can maintain good performance even in harsh operating environments.
Cost-effective: Compared to traditional SSDs or NVMe drives, eMMC is generally more cost-effective and suitable for cost-sensitive applications.
EMMC 5.1 | |||||||
Part number | Apply | Operating voltage | Operating temperature | Production status | interface | Package size | Capacity |
KLMEG4RCTE-B041 | Mobile | 1.8 / 3.3 V | -25 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 256 GB |
KLMCG1RCTE-B041 | Mobile | 1.8 / 3.3 V | -25 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 64 GB |
KLMDG2RCTE-B041 | Mobile | 1.8 / 3.3 V | -25 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 128 GB |
KLMCG2UCTB-B041 | Mobile | 1.8 / 3.3 V | -25 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 0.8 mm | 64 GB |
KLMDG4UCTB-B041 | Mobile | 1.8 / 3.3 V | -25 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 1.0 mm | 128 GB |
KLM4G1FETE-B041 | Mobile | 1.8 / 3.3 V | -25 ~ 85 °C | Mass Production | HS400 | 11 x 10 x 0.8 mm | 4 GB |
KLM8G1GEUF-B04P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 8 GB |
KLM8G1GEUF-B04Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 8 GB |
KLMAG2GEUF-B04P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 16 GB |
KLMAG2GEUF-B04Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 16 GB |
KLMBG4GEUF-B04P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 32 GB |
KLMBG4GEUF-B04Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 32 GB |
KLM8G1GESD-B04P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 0.8 mm | 8 GB |
KLM8G1GESD-B04Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | EOL | HS400 | 11.5 x 13 x 0.8 mm | 8 GB |
KLM8G1GETF-B041 | Mobile | 1.8 / 3.3 V | -25 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 8 GB |
KLMAG1JETD-B041 | Mobile | 1.8 / 3.3 V | -25 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 16 GB |
KLMAG2GESD-B04P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 0.8 mm | 16 GB |
KLMAG2GESD-B04Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | EOL | HS400 | 11.5 x 13 x 0.8 mm | 16 GB |
KLMBG2JETD-B041 | Mobile | 1.8 / 3.3 V | -25 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 0.8 mm | 32 GB |
KLMBG4GESD-B04P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 1.0 mm | 32 GB |
KLMBG4GESD-B04Q | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 1.0 mm | 32 GB |
KLMCG4JETD-B041 | Mobile | 1.8 / 3.3 V | -25 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 1.0 mm | 64 GB |
KLMCG4JEUD-B04P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 1.2 mm | 64 GB |
KLMCG4JEUD-B04Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production | HS400 | 11.5 x 13 x 1.2 mm | 64 GB |
KLMCG8GESD-B04P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 1.0 mm | 64 GB |
KLMCG8GESD-B04Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | EOL | HS400 | 11.5 x 13 x 1.0 mm | 64 GB |
KLMDG8JEUD-B04P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | Mass Production | HS400 | 11.5 x 13 x 1.2 mm | 128 GB |
KLMDG8JEUD-B04Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | Mass Production | HS400 | 11.5 x 13 x 1.2 mm | 128 GB |
EMMC 5.0 | |||||||
Part number | Apply | Operating voltage | Operating temperature | Production status | interface | Package size | Capacity |
KLM8G1GESD-B03P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 0.8 mm | 8 GB |
KLM8G1GESD-B03Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | EOL | HS400 | 11.5 x 13 x 0.8 mm | 8 GB |
KLMAG2GESD-B03P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 0.8 mm | 16 GB |
KLMAG2GESD-B03Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | EOL | HS400 | 11.5 x 13 x 0.8 mm | 16 GB |
KLMBG4GESD-B03P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 1.0 mm | 32 GB |
KLMBG4GESD-B03Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | EOL | HS400 | 11.5 x 13 x 1.0 mm | 32 GB |
KLMCG8GESD-B03P | Automotive | 1.8 / 3.3 V | -40 ~ 85 °C | EOL | HS400 | 11.5 x 13 x 1.0 mm | 64 GB |
KLMCG8GESD-B03Q | Automotive | 1.8 / 3.3 V | -40 ~ 105 °C | EOL | HS400 | 11.5 x 13 x 1.0 mm | 64 GB |
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