DRAM manufacturers are collectively “abandoning” DDR4, and the capacity shift sends a clear signal

Recently, the world’s top three DRAM manufacturers (Micron, Samsung, SK Hynix) have successively announced plans to discontinue or reduce DDR4 production, foreshadowing a transformation in the memory market landscape. Micron plans to gradually stop DDR4 shipments for client PCs, mobile devices, and data centers over the next 2-3 quarters, retaining supply only for special sectors like automotive, industrial, and network facilities. Samsung has notified OEM customers that its DDR4 module products will enter the End of Life (EOL) phase by the end of 2025, with the last order date for mainstream specifications like 8GB and 16GB set for early June 2025, and the final shipment date by December 10, 2025. SK Hynix is even more direct, reducing its DDR4 capacity ratio from 30% in 2024 to 20% by the end of 2025, fully betting on HBM and enterprise-grade SSDs to meet AI server demands.

Manufacturers aim at two key goals—reducing inventory pressure and alleviating losses by cutting mature process capacities, while shifting resources to advanced processes like DDR5 and HBM to seize the AI and high-performance computing 赛道. This strategic adjustment has triggered a chain reaction in the market, becoming the direct cause of the subsequent DDR4 price surge.